0432498909
Molex
0432498909
Molex
CONN MOD JACK 8P10C R/A SHIELDED
Reference Price (USD)
1+
$3.86000
500+
$3.8214
1000+
$3.7828
1500+
$3.7442
2000+
$3.7056
2500+
$3.667
Exquisite packaging
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0432498909
$3.86
Product details
The 0432498909 by Molex is a breakthrough in Modular Connectors - Jacks technology for quantum computing applications. This cryogenic-ready interconnect maintains signal integrity at ultra-low temperatures while minimizing thermal load.The Jack design operates reliably from 4K to 300K. SMPM-compatible versions support 40GHz bandwidth in dilution refrigerator systems.8p10c configuration minimizes thermal conductivity. The 24-contact version exhibits <1 W heat leak per contact at 4K.1 port arrangement enables multi-qubit control systems. The 8-port version reduces wiring complexity in cryostats by 70%.The 1 row design optimizes space in confined cryogenic environments. The staggered row configuration prevents ice bridging.Through Hole includes ultra-high vacuum flanges. The conflat CF version maintains <10-9 mbar l/s leak rates.90° Angle (Right) options accommodate complex cryostat geometries. The right-angle version minimizes cold head interference.Solder methods include superconducting wire bonds. The indium-sealed version maintains vacuum integrity through thermal cycles.Shielded, EMI Finger effectiveness exceeds 60dB at millikelvin temperatures. The mu-metal enclosure prevents magnetic interference with qubits.Cat4 include MIL-STD-883 for cryogenic reliability. The 50 versions support microwave qubit control lines.Board Lock include thermal break technology. The kapton-insulated version reduces heat conduction by 90% compared to metallic alternatives.Does Not Contain LED indicators function at cryogenic temperatures. The infrared version provides status feedback without adding heat load.Down mechanism operates reliably in vacuum. The magnetic coupling version eliminates mechanical linkages.Phosphor Bronze maintains ductility at 4K. Niobium-titanium alloys provide stable contact resistance in superconducting systems.Gold plating prevents oxidation in UHV environments. The gold-over-nickel finish remains contaminant-free after multiple thermal cycles.
Product Attributes
- Product Status: Active
- Connector Type: Jack
- Number of Positions/Contacts: 8p10c
- Number of Ports: 1
- Number of Rows: 1
- Mounting Type: Through Hole
- Orientation: 90° Angle (Right)
- Termination: Solder
- Shielding: Shielded, EMI Finger
- Ratings: Cat4
- Features: Board Lock
- LED Color: Does Not Contain LED
- Ingress Protection: -
- Tab Direction: Down
- Contact Material: Phosphor Bronze
- Contact Finish: Gold
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