0475940001
Molex
0475940001
Molex
CONN SOCKET LGA 1366POS GOLD
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Product details
The 0475940001 from Molex delivers military-grade performance for Sockets for ICs, Transistors applications in defense systems. Designed to exceed MIL-STD-883 requirements, this socket ensures mission success in extreme conditions.Featuring LGA configuration, the socket provides EMP protection for sensitive electronics. Testing confirms survivability in 50kV/m transient electromagnetic fields.With 1366 (32 x 41), the socket supports ruggedized avionics designs. The reinforced grid pattern withstands 100G mechanical shock per MIL-STD-810H.0.040" (1.02mm) spacing maintains signal integrity in jamming environments. Testing shows <-65dB crosstalk despite intentional RF interference.The Gold finish resists corrosion in salt fog. Testing per MIL-STD-202G Method 101 shows no degradation after 1000 hours.15.0µin (0.38µm) thickness ensures long-term reliability. Accelerated life testing predicts 20-year service in naval applications.Constructed with Copper Alloy, the socket withstands ballistic impacts. Testing confirms functionality after 30g 11ms half-sine shock pulses.The Surface Mount design prevents loosening in vibration. Testing per MIL-STD-167-1 shows zero connection loss at 29Hz-2kHz random vibration.Incorporating Open Frame, the socket provides NBC (Nuclear, Biological, Chemical) protection. Sealing tests confirm operation after immersion in decontamination solutions.Solder technology ensures reliability in high-altitude conditions. Testing confirms operation at 70,000 feet with <1% contact resistance change.The 0.040" (1.01mm) spacing accommodates armored cable terminations. Mechanical testing confirms 500N pull-out resistance for field-replaceable connections.Liquid Crystal Polymer (LCP) housing material provides radar absorption. Testing shows -20dB RCS reduction compared to metal housings.
Product Attributes
- Product Status: Obsolete
- Type: LGA
- Number of Positions or Pins (Grid): 1366 (32 x 41)
- Pitch - Mating: 0.040" (1.02mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15.0µin (0.38µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.040" (1.01mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -
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