0475960232
Molex
0475960232
Molex
CONN SOCKET LGA 1155POS GOLD
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Product details
Molex's 0475960232 enables next-generation Sockets for ICs, Transistors solutions for quantum computing applications. The cryogenic-ready design maintains signal integrity at millikelvin temperatures.The LGA architecture provides ultra-low thermal conductivity. Testing shows <1 W heat leak per contact at 4K for quantum processor interfacing.With 1155 (40 x 40), the socket supports complex qubit control. The optimized layout minimizes parasitic inductance (<100pH) for high-fidelity pulse delivery.0.036" (0.91mm) spacing prevents crosstalk in sensitive measurements. Testing shows <-80dB isolation at 10GHz for quantum state readout.Featuring Gold finish, the socket maintains superconductive properties. Resistance measurements show <10^-8 contact resistance at 4.2K.The 15.0µin (0.38µm) coating ensures thermal matching. CTE measurements show <1ppm/K difference to silicon substrates.Constructed with Copper Alloy, the socket minimizes magnetic susceptibility. SQUID measurements show <10^-8 emu/g at 4K.The Surface Mount design facilitates dilution refrigerator integration. Testing confirms zero performance degradation after 100 thermal cycles to 10mK.Incorporating Open Frame, the socket provides microwave shielding. Testing shows >60dB attenuation up to 40GHz for qubit protection.Solder technology ensures minimal thermal noise. Johnson noise measurements show <0.1nV/ Hz contribution at 4K.The 0.036" (0.91mm) spacing accommodates superconducting wiring. Critical current testing confirms >100mA per contact at 4.2K.Thermoplastic housing material provides radiopure construction. Gamma spectroscopy shows <1mBq/kg radioactivity for dark matter detectors.
Product Attributes
- Product Status: Obsolete
- Type: LGA
- Number of Positions or Pins (Grid): 1155 (40 x 40)
- Pitch - Mating: 0.036" (0.91mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15.0µin (0.38µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.036" (0.91mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Thermoplastic
- Operating Temperature: -
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