0731740290
Molex
0731740290
Molex
CONN 1.0/2.3 JCK STR 50OHM SOLDR
Reference Price (USD)
1+
$2.60855
500+
$2.5824645
1000+
$2.556379
1500+
$2.5302935
2000+
$2.504208
2500+
$2.4781225
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
0731740290
$2.61
Product details
Molex's 0731740290 revolutionizes Coaxial Connectors (RF) connectivity for terahertz imaging systems. Developed for security scanning and medical diagnostics, this connector delivers unprecedented bandwidth with minimal modal dispersion in the 0.1-10THz spectrum.The 1.0/2.3 interface features photonic crystal fiber alignment for optimal Gaussian beam coupling. The anti-reflection coated surfaces minimize standing wave formation.Utilizing Jack, Female Socket topology, the connector achieves <0.01dB/mm attenuation at 1THz. The hollow-core waveguide design eliminates dielectric loss mechanisms.Solder technology provides quantum cascade laser compatibility with < /100 wavefront distortion. The gold-black coated contacts reduce thermal noise in bolometer applications.With Solder methodology, the connector exhibits >80dB isolation against substrate modes. The corrugated horn design ensures pure HE11 mode propagation.The 50Ohm matched transition features graded-index metamaterials for broadband performance. Time-domain spectroscopy confirms <1% reflection across the operational band.Optimized for Panel Mount integration, the connector maintains <5 m alignment tolerance. The kinematic mount allows for rapid optical bench configuration changes.Engineered with Bulkhead - Rear Side Nut, the connector withstands 100G shock loads without misalignment. The invar-based construction minimizes thermal drift.The Threaded mechanism provides sub-wavelength positional accuracy with <1 m repeatability. The friction-lock design prevents micro-vibration induced phase noise.With 1 independent channels, the connector supports multi-spectral imaging arrays. Each port features integrated beam collimation optics.Advanced Extended Insulation include integrated Golay cell detectors for power monitoring. The connector is compatible with synchrotron radiation facilities' ultra-high vacuum requirements.The Gold housing material exhibits <0.001 absorption coefficient at THz frequencies. The diamond-turned surface finish minimizes scattering losses.The Beryllium Copper formulation provides <10nm RMS surface roughness. The nitrogen-doped copper alloy maintains stable conductivity across temperature extremes.
Product Attributes
- Product Status: Active
- Connector Style: 1.0/2.3
- Connector Type: Jack, Female Socket
- Contact Termination: Solder
- Shield Termination: Solder
- Impedance: 50Ohm
- Mounting Type: Panel Mount
- Mounting Feature: Bulkhead - Rear Side Nut
- Cable Group: -
- Fastening Type: Threaded
- Frequency - Max: -
- Number of Ports: 1
- Features: Extended Insulation
- Housing Color: Gold
- Ingress Protection: -
- Center Contact Material: Beryllium Copper
You May Also Be Interested In