0731740832
Molex
0731740832
Molex
CA,MICRO COAX X 2,1.13MM CBL,180
Reference Price (USD)
1+
$5.60107
500+
$5.5450593
1000+
$5.4890486
1500+
$5.4330379
2000+
$5.3770272
2500+
$5.3210165
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
0731740832
$5.60
Product details
Molex's 0731740832 revolutionizes Coaxial Connectors (RF) connectivity for terahertz imaging systems. Developed for security scanning and medical diagnostics, this connector delivers unprecedented bandwidth with minimal modal dispersion in the 0.1-10THz spectrum.The 1.0/2.3 interface features photonic crystal fiber alignment for optimal Gaussian beam coupling. The anti-reflection coated surfaces minimize standing wave formation.Utilizing Jack, Female Socket topology, the connector achieves <0.01dB/mm attenuation at 1THz. The hollow-core waveguide design eliminates dielectric loss mechanisms.Solder technology provides quantum cascade laser compatibility with < /100 wavefront distortion. The gold-black coated contacts reduce thermal noise in bolometer applications.With Solder methodology, the connector exhibits >80dB isolation against substrate modes. The corrugated horn design ensures pure HE11 mode propagation.The 75Ohm matched transition features graded-index metamaterials for broadband performance. Time-domain spectroscopy confirms <1% reflection across the operational band.Optimized for Board Edge, Cutout; Surface Mount integration, the connector maintains <5 m alignment tolerance. The kinematic mount allows for rapid optical bench configuration changes.The Push-Pull mechanism provides sub-wavelength positional accuracy with <1 m repeatability. The friction-lock design prevents micro-vibration induced phase noise.Characterized at 3 GHz, the connector shows <0.5dB insertion loss up to 5THz. The surface plasmon-enhanced design minimizes conductor losses.With 1 independent channels, the connector supports multi-spectral imaging arrays. Each port features integrated beam collimation optics.The Gold housing material exhibits <0.001 absorption coefficient at THz frequencies. The diamond-turned surface finish minimizes scattering losses.The Beryllium Copper formulation provides <10nm RMS surface roughness. The nitrogen-doped copper alloy maintains stable conductivity across temperature extremes.
Product Attributes
- Product Status: Active
- Connector Style: 1.0/2.3
- Connector Type: Jack, Female Socket
- Contact Termination: Solder
- Shield Termination: Solder
- Impedance: 75Ohm
- Mounting Type: Board Edge, Cutout; Surface Mount
- Mounting Feature: -
- Cable Group: -
- Fastening Type: Push-Pull
- Frequency - Max: 3 GHz
- Number of Ports: 1
- Features: -
- Housing Color: Gold
- Ingress Protection: -
- Center Contact Material: Beryllium Copper
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