0760551608
Molex
0760551608
Molex
CONN HEADER IMPACT 240POS PCB
Reference Price (USD)
1+
$17.98817
500+
$17.8082883
1000+
$17.6284066
1500+
$17.4485249
2000+
$17.2686432
2500+
$17.0887615
Exquisite packaging
Discount
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0760551608
$17.99
Product details
The 0760551608 from Molex represents a cutting-edge solution in Backplane Connectors - Specialized, engineered for high-density backplane applications requiring exceptional signal integrity. This advanced connector system combines robust construction with precision engineering to deliver reliable performance in mission-critical environments.With Header, Male Pins configuration, this component ensures optimal mating compatibility while maintaining superior electrical characteristics. The hermaphroditic contact design enhances assembly flexibility in complex systems.Featuring Impact technology, the connector achieves industry-leading contact reliability, particularly beneficial for high-vibration environments found in industrial automation equipment.The 240 position count provides exceptional scalability for backplane architectures, enabling designers to implement modular system designs with simplified interconnect schemes.When configured with All loaded positions, the connector offers customizable solutions for power distribution networks without compromising signal path density.With 0.053" (1.35mm) centerline spacing, the design achieves optimal balance between high-density packaging and manufacturability requirements.The 15 row configuration enables three-dimensional backplane stacking, particularly valuable in data center orthogonal interconnect architectures.The 16 column arrangement supports wide bus architectures while maintaining controlled impedance characteristics across all signal paths.The Through Hole mounting option facilitates both standard and high-reliability PCB attachment methods, with proven performance in through-hole reflow processes.Press-Fit methods provide flexibility for both automated assembly processes and field-serviceable connections in telecom infrastructure.The 80 Differential Pairs arrangement optimizes impedance matching while providing balanced power delivery - crucial for maintaining signal integrity in 5G base station applications.Gold plating ensures durable contact surfaces capable of withstanding multiple mating cycles, meeting MIL-STD-202H standards for harsh environment operation.The 30.0µin (0.76µm) coating thickness exceeds industry standards for corrosion resistance, ensuring long-term reliability in humid operating conditions.The Black housing material complies with UL94V-0 flammability ratings while providing visual differentiation for complex cabling systems.
Product Attributes
- Product Status: Active
- Connector Usage: -
- Connector Type: Header, Male Pins
- Connector Style: Impact
- Number of Positions: 240
- Number of Positions Loaded: All
- Pitch: 0.053" (1.35mm)
- Number of Rows: 15
- Number of Columns: 16
- Mounting Type: Through Hole
- Termination: Press-Fit
- Contact Layout, Typical: 80 Differential Pairs
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: Black
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