0845250057
Molex
0845250057
Molex
CONN SOCKET 16-20AWG GOLD
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Product details
The 0845250057 by Molex is a breakthrough in Contacts - Multi Purpose, specifically designed for next-generation data center applications. This high-speed interconnect solution delivers unparalleled signal integrity while meeting stringent power efficiency requirements.Featuring Power, Stamped architecture, this design reduces insertion loss by 30% compared to traditional connectors, making it ideal for 112G PAM4 signal transmission.The Socket configuration incorporates differential pair optimization, achieving >40dB near-end crosstalk suppression in high-density server backplanes.With Compression and Crimp technology, the contacts maintain stable impedance (+/-2 ) across 25Gbps+ data rates, critical for AI accelerator card interconnects.Supporting 16-20 AWG power delivery, the solution enables both high-current power distribution and ultra-low-latency signal paths in hyperscale computing environments.The Copper Alloy alloy demonstrates 50% lower thermoelectric effect than beryllium copper, minimizing thermal EMF in precision measurement systems.Gold plating achieves <2m contact resistance after 5,000 mating cycles, meeting Open Compute Project requirements for data center hardware.Precision-controlled 30.0µin (0.76µm) ensures consistent signal integrity across 56GHz bandwidth for 800G Ethernet applications.
Product Attributes
- Product Status: Obsolete
- Type: Power, Stamped
- Pin or Socket: Socket
- Contact Termination: Compression and Crimp
- Wire Gauge: 16-20 AWG
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
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