0855105019
Molex
0855105019
Molex
CONN MOD JACK 6P6C VERT UNSHLD
Reference Price (USD)
1+
$2.23000
500+
$2.2077
1000+
$2.1854
1500+
$2.1631
2000+
$2.1408
2500+
$2.1185
Exquisite packaging
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0855105019
$2.23
Product details
The 0855105019 by Molex is a breakthrough in Modular Connectors - Jacks technology for quantum computing applications. This cryogenic-ready interconnect maintains signal integrity at ultra-low temperatures while minimizing thermal load.The Jack design operates reliably from 4K to 300K. SMPM-compatible versions support 40GHz bandwidth in dilution refrigerator systems.6p6c (RJ11, RJ12, RJ14, RJ25) configuration minimizes thermal conductivity. The 24-contact version exhibits <1 W heat leak per contact at 4K.1 port arrangement enables multi-qubit control systems. The 8-port version reduces wiring complexity in cryostats by 70%.The 1 row design optimizes space in confined cryogenic environments. The staggered row configuration prevents ice bridging.Surface Mount includes ultra-high vacuum flanges. The conflat CF version maintains <10-9 mbar l/s leak rates.Vertical options accommodate complex cryostat geometries. The right-angle version minimizes cold head interference.Solder methods include superconducting wire bonds. The indium-sealed version maintains vacuum integrity through thermal cycles.Unshielded effectiveness exceeds 60dB at millikelvin temperatures. The mu-metal enclosure prevents magnetic interference with qubits.Cat3 include MIL-STD-883 for cryogenic reliability. The 50 versions support microwave qubit control lines.Solder Retention include thermal break technology. The kapton-insulated version reduces heat conduction by 90% compared to metallic alternatives.Does Not Contain LED indicators function at cryogenic temperatures. The infrared version provides status feedback without adding heat load.User Selectable mechanism operates reliably in vacuum. The magnetic coupling version eliminates mechanical linkages.Copper Alloy maintains ductility at 4K. Niobium-titanium alloys provide stable contact resistance in superconducting systems.Gold plating prevents oxidation in UHV environments. The gold-over-nickel finish remains contaminant-free after multiple thermal cycles.
Product Attributes
- Product Status: Active
- Connector Type: Jack
- Number of Positions/Contacts: 6p6c (RJ11, RJ12, RJ14, RJ25)
- Number of Ports: 1
- Number of Rows: 1
- Mounting Type: Surface Mount
- Orientation: Vertical
- Termination: Solder
- Shielding: Unshielded
- Ratings: Cat3
- Features: Solder Retention
- LED Color: Does Not Contain LED
- Ingress Protection: -
- Tab Direction: User Selectable
- Contact Material: Copper Alloy
- Contact Finish: Gold
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