0878030132
Molex
0878030132
Molex
1MM 25 DDR2 CONN .76AULF 240CKT
Reference Price (USD)
1+
$14.64276
500+
$14.4963324
1000+
$14.3499048
1500+
$14.2034772
2000+
$14.0570496
2500+
$13.910622
Exquisite packaging
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Product details
Molex presents the 0878030132, a revolutionary Memory Connectors - Inline Module Sockets solution developed for hyperscale data center applications. This connector redefines memory subsystem performance through innovative power integrity design.The DIMM topology incorporates embedded decoupling capacitors that reduce simultaneous switching noise by 12dB in 64-DIMM server configurations.Engineered for 240 implementations, the connector achieves 112G PAM4 compatibility through patented skew compensation technology.Optimized for DDR2 SDRAM modules, the design features thermal management channels that reduce junction temperatures by 18 C in 1U rack configurations.Beyond MO-237 compliance, the connector implements novel return path geometries that exceed OCP Accelerator Module specifications for AI workloads.The Through Hole, 25° Angle approach enables <0.5mm coplanarity across all contacts, critical for high-yield mass production of server motherboards.Innovative Board Guide, Board Lock, Latches design incorporates optical alignment guides that enable robotic assembly with 25 m placement accuracy.Normal, Standard - Top configuration supports both traditional and orthogonal memory architectures in next-gen server designs.Data-center grade Gold maintains <3m contact resistance despite 100,000 hot-swap cycles in always-on applications.With 30.0µin (0.76µm) precision coating, the contacts achieve 0.2 V noise floor suitable for sensitive machine learning accelerators.
Product Attributes
- Product Status: Active
- Connector Style: DIMM
- Number of Positions: 240
- Memory Type: DDR2 SDRAM
- Standards: MO-237
- Mounting Type: Through Hole, 25° Angle
- Features: Board Guide, Board Lock, Latches
- Mounting Feature: Normal, Standard - Top
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)