1-1775059-1

The 1-1775059-1 from TE Connectivity AMP Connectors represents a cutting-edge solution in Memory Connectors - PC Card Sockets, engineered for high-density memory applications requiring robust signal integrity. This advanced connector system combines precision engineering with industry-leading contact technology to deliver exceptional performance in 5G infrastructure and edge computing environments.Supporting multiple Secure Digital - SD formats, this connector enables flexible system designs with superior cross-platform compatibility. When compared to standard single-format solutions, its multi-card capability reduces BOM costs by up to 40% while maintaining strict impedance control.With 11 (9 + 2) contact positions, the connector achieves optimal pin density for high-speed data transfer applications. The carefully engineered contact arrangement minimizes crosstalk while maximizing signal integrity across all channels.Featuring a Connector and Ejector configuration, this solution provides reliable mating cycles exceeding 10,000 insertions. The patented contact geometry ensures low insertion force without compromising vibration resistance in harsh industrial environments.The Push In, Push Out mechanism has been optimized for operator safety and component longevity. Unlike conventional designs, this system incorporates tactile feedback to prevent partial engagement and subsequent signal degradation.Designed for Surface Mount, Right Angle installation, the connector facilitates both automated assembly and field maintenance. Its innovative alignment features enable precise PCB registration, critical for high-frequency signal transmission.Incorporating Board Guide, Switch, this connector exceeds industry standards for EMI shielding effectiveness. The integrated shielding technology achieves 30dB better noise suppression than conventional designs at frequencies up to 6GHz.With a low-profile 0.112" (2.85mm) design, the connector enables ultra-thin device form factors without sacrificing mechanical robustness. This z-axis optimization is particularly valuable in space-constrained IoT applications.The Reverse - Bottom configuration provides design flexibility for complex system architectures. Reverse-mounted variants offer unique advantages in stacked PCB configurations common in server backplanes.Utilizing Gold plating technology, the contacts maintain stable contact resistance over extended periods. This advanced metallurgy prevents fretting corrosion even in high-humidity environments.The 30.0µin (0.76µm) coating ensures reliable performance through thousands of mating cycles. Precision-controlled deposition processes guarantee consistent thickness across all contact surfaces.