1-5352273-1

The 1-5352273-1 from TE Connectivity AMP Connectors revolutionizes Backplane Connectors - Hard Metric, Standard for military and aerospace applications. Built to withstand extreme environments, this connector series exceeds the most demanding MIL-SPEC requirements. Its ruggedized design ensures reliable operation in satellite systems, avionics, and defense electronics where mission success depends on absolute connection integrity.Featuring Header, Male Pins configuration, this mil-spec connector incorporates hermetic sealing technology. The glass-filled housing maintains seal integrity at altitudes exceeding 70,000 feet.The C 11 mechanical design includes positive locking mechanisms that withstand 50G shock loads. This exceeds MIL-DTL-38999 Series III requirements for naval applications.With 55 available circuits, this solution supports complex weapon system architectures. The optimized layout provides 100dB EMI shielding effectiveness from 10MHz to 18GHz.The All configuration enables redundant power distribution networks. Heavy-duty contacts maintain performance after 500 hours of salt fog exposure per MIL-STD-810.The 0.079" (2.00mm) spacing achieves military-grade density while maintaining 500V/mil dielectric strength. The radiation-resistant material maintains properties after 1Mrad gamma exposure.The 5 contact arrangement provides balanced mechanical loading during high-vibration events. This design passes MIL-STD-1344 Method 3007 vibration testing.Designed for Board Edge, Through Hole, Right Angle installation in harsh environments, this connector features corrosion-resistant mounting hardware. The stainless steel fasteners meet NAS standards for aerospace applications.The Press-Fit process creates cryogenically stable connections that operate from -65 C to +200 C. The crimp joints maintain gas-tight seals during rapid thermal cycling.Specifically engineered for Backplane in defense systems, this series meets MIL-PRF-55302 environmental requirements. The EMP-hardened design protects sensitive electronics from transient threats.