100-1225-1

The 100-1225-1 from BECOM Systems GmbH represents a cutting-edge solution in the Embedded - Microcontroller, Microprocessor, FPGA Modules segment, engineered for high-performance embedded systems. This module combines advanced signal processing capabilities with robust power efficiency, making it ideal for 5G infrastructure and edge computing applications where low-latency operation is critical.Featuring a versatile MPU Core architecture, this component delivers exceptional flexibility for multi-core processing tasks. When compared to conventional designs, its hybrid FPGA-MPU configuration enables superior parallel computation while maintaining precise clock synchronization across all cores.At the heart of the system lies the TCM-BF537, optimized for real-time digital signal processing with its advanced pipeline architecture. The processor's instruction set acceleration ensures deterministic execution cycles, crucial for industrial automation timing constraints.Operating at 500MHz, the module achieves industry-leading performance-per-watt metrics. This clock frequency has been carefully validated to maintain signal integrity while minimizing electromagnetic interference in dense PCB layouts.With 8MB of non-volatile memory, the device offers ample storage for firmware and configuration data. The flash memory subsystem incorporates error correction codes (ECC) to ensure data reliability in mission-critical aerospace applications.The 32MB high-speed memory supports demanding multi-threaded operations. Its low-latency access architecture is particularly effective for buffering high-bandwidth sensor data in autonomous driving systems.The Expansion 2 x 60 interface provides robust mechanical and electrical connections, developed for vibration-resistant industrial environments. Its impedance-matched design preserves signal quality even in extended cable runs common in factory automation.Measuring just 1.1" x 1.1" (28mm x 28mm), this compact form factor enables high-density installations. The precision-engineered package maintains thermal performance characteristics essential for medical imaging equipment.Rated for -40°C ~ 85°C, the module delivers reliable operation in extreme conditions. This temperature resilience, combined with conformal coating options, makes it suitable for outdoor IoT deployments in harsh climates.