10081530-11117LF

Amphenol ICC (FCI)'s 10081530-11117LF represents the next evolution in Memory Connectors - Inline Module Sockets technology, optimized for industrial automation systems demanding ruggedized memory solutions. The 10081530-11117LF combines military-grade durability with cutting-edge signal integrity features.Utilizing RDIMM architecture, the connector achieves 360 shielding effectiveness for operation in electrically noisy factory environments with >60dB EMI suppression.The 240 configuration supports parallel memory bus architectures while maintaining crosstalk below -40dB at 5GHz frequencies for PLC applications.Specially engineered for DDR3 SDRAM compatibility, the contact system features dual-beam design that compensates for PCB warpage up to 0.15mm in harsh industrial conditions.Meeting MO-269 requirements, the connector undergoes 100% automated optical inspection to ensure sub-micron alignment accuracy for Industry 4.0 equipment.Designed for Through Hole implementation, the package withstands 50G mechanical shock and 10G vibration profiles per IEC 60068-2 standards.The integrated Board Lock, Latches system enables tool-less module installation while providing IP67-rated dust/fluid protection for food processing machinery applications.Normal, Standard - Top configuration allows direct integration with backplane designs, reducing signal path length by 30% compared to conventional right-angle solutions.Gold surface treatment achieves >1000N/mm contact normal force, preventing micro-arcing in high-altitude industrial environments.With 15.0µin (0.38µm) deposition, the contacts maintain <2m resistance drift after 2000 thermal cycles from -40 C to +105 C.