10081530-11185LF
Amphenol ICC (FCI)
10081530-11185LF
Amphenol ICC (FCI)
CONN SKT RDIMM 240POS PCB
Reference Price (USD)
1+
$1.68021
500+
$1.6634079
1000+
$1.6466058
1500+
$1.6298037
2000+
$1.6130016
2500+
$1.5961995
Exquisite packaging
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Product details
The 10081530-11185LF from Amphenol ICC (FCI) delivers aerospace-grade reliability for Memory Connectors - Inline Module Sockets in satellite communications systems. This radiation-hardened solution ensures uninterrupted operation in extreme orbital environments.Space-qualified RDIMM design features triple-redundant locking mechanisms that maintain connection integrity during 25G launch vibrations.With 240 gold-plated contacts, the connector achieves <0.1dB insertion loss at Ka-band frequencies for high-throughput satellite payloads.Certified for DDR3 SDRAM modules, the design incorporates charge-dissipative materials that prevent electrostatic discharge in vacuum environments.Meeting MO-269 requirements, the connector passes NASA outgassing tests with <0.1% TML and <0.01% CVCM for long-duration space missions.The Through Hole configuration enables hermetic sealing capable of maintaining 10-6 atm-cc/sec helium leak rates in GEO satellite applications.Radiation-tolerant Board Lock, Latches include shielding that attenuates single-event effects from cosmic rays up to 100MeV/(mg/cm ).Normal, Standard - Top orientation supports both planar and stacked PCB configurations common in satellite avionics systems.Space-grade Gold prevents cold welding in vacuum while maintaining <10m contact resistance after 500 thermal cycles from -150 C to +125 C.Precision 20.0µin (0.51µm) coating ensures stable performance despite atomic oxygen exposure in LEO environments.
Product Attributes
- Product Status: Active
- Connector Style: RDIMM
- Number of Positions: 240
- Memory Type: DDR3 SDRAM
- Standards: MO-269
- Mounting Type: Through Hole
- Features: Board Lock, Latches
- Mounting Feature: Normal, Standard - Top
- Contact Finish: Gold
- Contact Finish Thickness: 20.0µin (0.51µm)