101110061
Seeed Technology Co., Ltd
Product details
Seeed Technology Co., Ltd's 101110061 represents a quantum leap in Thermal - Heat Sinks technology for LED lighting applications. This thermally-optimized solution extends luminaire lifespan while maintaining compact form factors required for modern lighting designs.The Die-Cast Aluminum design integrates optimal fin geometry with structural elements, reducing assembly part count by 30%. Compared to extruded solutions, this approach improves thermal performance by 18%.Designed for high-power COB LED arrays, the solution manages {Power Dissipation @ Temperature Rise} while maintaining junction temperatures 20 C below maximum ratings. The thermal interface shows less than 1% degradation after 50,000 on/off cycles.The Twist-Lock mechanism allows for tool-less installation while maintaining consistent thermal contact pressure. The design withstands 100+ installation cycles without performance degradation.Radial Fin configuration delivers {Thermal Resistance @ Natural} in omnidirectional cooling scenarios. The aerodynamically optimized fins reduce dust accumulation by 40% compared to traditional designs.The 2.244" (57.00mm) dimension accommodates standard LED module sizes while providing sufficient thermal mass. The design prevents thermal shadowing in multi-source luminaires.With 1.614" (41.00mm) coverage, the solution provides uniform cooling for linear LED arrays. Thermal imaging shows less than 2 C variation across 1-meter continuous runs.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: Nvidia Jetson Nano
- Attachment Method: Bolt On and Thermal Tape, Adhesive (Included)
- Shape: Rectangular
- Length: 2.244" (57.00mm)
- Width: 1.614" (41.00mm)
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -