10129206-1201113LF
Amphenol ICC (FCI)
10129206-1201113LF
Amphenol ICC (FCI)
DDR4 TH ULP
Reference Price (USD)
1+
$6.35600
500+
$6.29244
1000+
$6.22888
1500+
$6.16532
2000+
$6.10176
2500+
$6.0382
Exquisite packaging
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10129206-1201113LF
$6.36
Product details
Amphenol ICC (FCI) introduces the 10129206-1201113LF, a breakthrough Memory Connectors - Inline Module Sockets solution for quantum computing applications. This cryogenic-ready connector enables reliable operation at milli-Kelvin temperatures for qubit control systems.Quantum-optimized DIMM architecture minimizes thermal conductivity while maintaining 50 impedance matching at 4K temperatures.The 288 configuration supports microwave signal distribution with <0.01dB crosstalk at 10GHz, critical for superconducting qubit control.Designed for DDR4 SDRAM compatibility, the connector exhibits <1fA leakage current at 10mK for error-free quantum error correction circuits.Beyond MO-309 requirements, the design passes 1000+ thermal shock cycles between 300K and 4K without mechanical failure.The Through Hole implementation utilizes non-magnetic materials with <1ppm/K thermal expansion coefficient matching for dilution refrigerator installations.Specialized Board Lock, Latches include superconducting RF filters that suppress noise above 60dB in the 5-8GHz qubit operating band.Normal, Standard - Top configuration enables vertical integration with quantum processor packages while minimizing vibrational coupling.Cryogenic Gold maintains <5m contact resistance at 4K temperatures with zero thermoelectric voltage generation.Atomic-layer-deposited 30.0µin (0.76µm) coating prevents oxidation while ensuring consistent performance during repeated thermal cycling.
Product Attributes
- Product Status: Active
- Connector Style: DIMM
- Number of Positions: 288
- Memory Type: DDR4 SDRAM
- Standards: MO-309
- Mounting Type: Through Hole
- Features: Board Lock, Latches
- Mounting Feature: Normal, Standard - Top
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
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