1049081-2
TE Connectivity Aerospace, Defense and Marine
1049081-2
TE Connectivity Aerospace, Defense and Marine
CONN OSSP JACK STR 50 OHM SOLDER
Reference Price (USD)
1+
$75.30000
500+
$74.547
1000+
$73.794
1500+
$73.041
2000+
$72.288
2500+
$71.535
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
1049081-2
$75.30
Product details
The 1049081-2 by TE Connectivity Aerospace, Defense and Marine pioneers new frontiers in Coaxial Connectors (RF) technology for fusion energy research. Designed for tokamak reactor environments, this connector maintains reliable performance under extreme neutron flux and plasma conditions.Featuring OSSP, Subminiature geometry, the connector achieves <1x10-12 A leakage current under 14MeV neutron radiation. The radiation-transparent dielectric minimizes activation products.With Jack, Female Socket configuration, the connector withstands 1000 thermal cycles between 4K and 1200K. The tungsten-rhenium alloy contacts resist embrittlement.Solder technology provides stable connections despite neutron-induced swelling. The dynamically compensated design maintains contact force during material expansion.The Solder system provides >100dB shielding against ICRH noise. The graded-Z shielding minimizes Bremsstrahlung radiation production.Precision-engineered 50Ohm accounts for plasma-induced dielectric changes. Real-time monitoring confirms <0.5% deviation during plasma pulses.Designed for Panel Mount, Snap-In installation in vacuum vessels, the connector survives 100G disruption events. The seismic-rated mounting meets ITER CODAC requirements.The Snap-On mechanism enables remote handling with >10,000 cycle life. The hot-cell compatible design allows for maintenance with robotic manipulators.Characterized at 18 GHz, the connector shows <0.01dB loss for ECRH transmission. The ultra-high vacuum design maintains <10-8 mbar pressure integrity.With 1 isolated channels, the connector supports multi-MW RF injection systems. Each port features integrated arc detection circuitry.The Gold ceramic housing provides <0.1% neutron absorption cross-section. The low-Z material minimizes neutron scattering effects.The Beryllium Copper formulation resists neutron transmutation damage. The molybdenum alloy maintains conductivity after 10dpa exposure.
Product Attributes
- Product Status: Active
- Connector Style: OSSP, Subminiature
- Connector Type: Jack, Female Socket
- Contact Termination: Solder
- Shield Termination: Solder
- Impedance: 50Ohm
- Mounting Type: Panel Mount, Snap-In
- Mounting Feature: -
- Cable Group: -
- Fastening Type: Snap-On
- Frequency - Max: 18 GHz
- Number of Ports: 1
- Features: -
- Housing Color: Gold
- Ingress Protection: -
- Center Contact Material: Beryllium Copper
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