10AS032E3F27E2SG
Intel
10AS032E3F27E2SG
Intel
IC SOC CORTEX-A9 1.5GHZ 672FBGA
Reference Price (USD)
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$1482.37000
500+
$1467.5463
1000+
$1452.7226
1500+
$1437.8989
2000+
$1423.0752
2500+
$1408.2515
Exquisite packaging
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10AS032E3F27E2SG
$1,482.37
Product details
Intel's 10AS032E3F27E2SG redefines Embedded - System On Chip (SoC) technology for professional audio equipment. Optimized for studio-grade signal processing, this SoC combines ultra-low distortion analog paths with powerful DSP capabilities, making 10AS032E3F27E2SG the preferred choice for digital mixers and audio interfaces where pristine signal quality is essential.The MCU, FPGA architecture features parallel DSP cores with dedicated audio processing accelerators for real-time effects processing.The Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core delivers the computational density needed for multi-channel audio processing with sample-accurate synchronization.With 256KB of high-fidelity RAM, the processor maintains zero-wait-state performance for audio buffer processing.Audio-specific DMA, POR, WDT include high-dynamic-range ADCs/DACs and professional digital audio interfaces.The EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports all major audio networking protocols while maintaining strict jitter performance.Operating at 1.5GHz, the processor meets the real-time requirements of high-channel-count audio systems.FPGA - 320K Logic Elements include hardware-accelerated floating-point processing for studio-quality effects algorithms.Designed for 0°C ~ 100°C (TJ) operation, the component maintains stable performance in demanding studio environments.The 672-BBGA, FCBGA package provides optimal EMI shielding for noise-sensitive audio applications.Available in 672-FBGA, FC (27x27), the device meets professional audio equipment reliability standards.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 320K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA, FC (27x27)
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