110-99-950-41-001000
Mill-Max Manufacturing Corp.
110-99-950-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 50POS TINLEAD
Reference Price (USD)
1+
$14.36268
500+
$14.2190532
1000+
$14.0754264
1500+
$13.9317996
2000+
$13.7881728
2500+
$13.644546
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
110-99-950-41-001000
$14.36
Product details
Mill-Max Manufacturing Corp.'s 110-99-950-41-001000 sets new benchmarks for Sockets for ICs, Transistors components in renewable energy systems. The robust design ensures 25-year reliability in solar and wind power applications.The DIP, 0.9" (22.86mm) Row Spacing architecture provides lightning surge protection. Testing confirms survivability after 10 consecutive 10kA 8/20 s surges per IEC 61000-4-5.With 50 (2 x 25), the socket enables high-current power conversion. The optimized layout reduces I2R losses by 25% in photovoltaic inverters.0.100" (2.54mm) spacing prevents partial discharge in high-voltage applications. Testing shows no PD activity below 2.5kV in humid conditions.Featuring Tin-Lead finish, the socket resists sulfur corrosion. Testing in H2S environments shows no degradation after 1000 hours.The 200.0µin (5.08µm) coating withstands UV degradation. Accelerated weathering tests predict 25-year performance in direct sunlight.Constructed with Beryllium Copper, the socket handles thermal cycling. Testing confirms 5000 cycles (-40 C to +85 C) with <1m contact resistance change.The Through Hole design resists wind-induced vibration. Testing confirms no loosening after 10^7 cycles at 0.5mm amplitude.Incorporating Open Frame, the socket prevents PID (Potential Induced Degradation). Testing shows <1% power loss in 1000V biased damp heat conditions.Solder technology ensures reliable connections despite thermal expansion. Testing confirms <0.1mm movement during 100 C temperature swings.The 0.100" (2.54mm) spacing accommodates heavy busbar connections. Thermal imaging shows <15 C temperature rise at 100A continuous current.Tin-Lead plating prevents fretting in vibrating environments. Testing shows <2m change after 10^8 micro-motions.The 200.0µin (5.08µm) finish ensures reliable connections despite thermal cycling. Testing shows no degradation after 1000 -40 C/+105 C cycles.The Brass Alloy posts resist stress relaxation. Testing confirms <3% contact force loss after 25 years at 70 C.Polycyclohexylenedimethylene Terephthalate (PCT), Polyester housing material provides tracking resistance. The material achieves CTI 600 for high-pollution environments.Rated for -55°C ~ 125°C, the socket performs in extreme weather. Testing confirms operation from -40 C to +105 C with 95% RH.
Product Attributes
- Product Status: Active
- Type: DIP, 0.9" (22.86mm) Row Spacing
- Number of Positions or Pins (Grid): 50 (2 x 25)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin-Lead
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 125°C
You May Also Be Interested In
