1103157-1
TE Connectivity
1103157-1
TE Connectivity
HVS-HV.2.BU.C
Reference Price (USD)
Exquisite packaging
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1103157-1
$3.94
Product details
TE Connectivity's 1103157-1 establishes new benchmarks in Heavy Duty Connectors - Inserts, Modules performance for hyperscale data centers. The patented airflow-optimized design reduces insertion loss while improving thermal dissipation by 30%. Essential for 400G Ethernet switches and AI accelerator racks where power integrity and thermal management directly impact computational throughput.Designed as Module without Contacts, the module integrates electromagnetic bandgap structures that suppress simultaneous switching noise below -60dB.The Female interface incorporates embedded equalization circuits that compensate for skin effect losses at millimeter-wave frequencies.The 2 matrix supports orthogonal midplane architectures with <0.5dB insertion loss variation across all channels.Utilizing Crimp technology, the system maintains <1.2:1 VSWR up to 50GHz through controlled impedance transitions.The 5000V isolation withstands 1500V surge transients common in power-over-fiber applications.Engineered for 16A per contact, the design implements distributed current paths to minimize localized heating.HVT contacts feature nitrogen-enriched gold plating that reduces organic contamination buildup in high-UPTIME environments.
Product Attributes
- Product Status: Active
- Connector Type: Module without Contacts
- Gender: Female
- Number of Positions: 2
- Size: -
- Termination Style: Crimp
- Voltage Rating: 5000V
- Current Rating (Amps): 16A
- Contact Type: HVT
- Operating Temperature: -
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