1107254-28
Aries Electronics
1107254-28
Aries Electronics
SOCKET ADAPTER DIP TO 28DIP 0.3
Reference Price (USD)
1+
$15.29000
500+
$15.1371
1000+
$14.9842
1500+
$14.8313
2000+
$14.6784
2500+
$14.5255
Exquisite packaging
Discount
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Product details
Aries Electronics's 1107254-28 establishes new benchmarks in Sockets for ICs, Transistors - Adapters technology, precision-crafted for aerospace and defense applications requiring uncompromising reliability. Its radiation-hardened design ensures consistent performance in extreme environmental conditions.Compatible with DIP, 0.6" (15.24mm) Row Spacing package formats, this adapter solves critical obsolescence challenges when maintaining legacy military systems with modern components.The DIP, 0.3" (7.62mm) Row Spacing output configuration supports MIL-STD-883 compliant interfaces, enabling seamless technology insertion in defense electronics upgrades.Featuring 28 hermetic-sealed contacts, the socket maintains signal integrity even in high-altitude or vacuum environments where outgassing is a concern.The 0.100" (2.54mm) contact spacing has been optimized for EMI/RFI suppression, incorporating built-in shielding features for sensitive analog measurement systems.With Gold plating, the contacts achieve cold-weld characteristics ideal for vibration-prone applications in vehicle-mounted electronics.The Through Hole implementation provides conformal coating compatibility while allowing for visual inspection of solder joints in high-reliability applications.Solder connections feature strain relief designs that exceed MIL-STD-202G vibration and shock requirements for military electronics.The 0.100" (2.54mm) post arrangement incorporates anti-wicking barriers that prevent solder migration in high-temperature operating environments.Posts with Tin finish maintain solder joint integrity through 1000+ thermal cycles from -65 C to +150 C.The Polyamide (PA46), Nylon 4/6, Glass Filled construction meets NASA outgassing specifications (ASTM E595) with total mass loss (TML) <1% and collected volatile condensable materials (CVCM) <0.1%.
Product Attributes
- Product Status: Active
- Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
- Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Number of Pins: 28
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Board Material: -