110991327
Seeed Technology Co., Ltd
110991327
Seeed Technology Co., Ltd
HEAT SINK KIT FOR RASPBERRY PI 4
Reference Price (USD)
1+
$0.99000
500+
$0.9801
1000+
$0.9702
1500+
$0.9603
2000+
$0.9504
2500+
$0.9405
Exquisite packaging
Discount
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110991327
$0.99
Product details
Optimized for automotive electronics, the 110991327 by Seeed Technology Co., Ltd sets new standards in Thermal - Heat Sinks reliability. This AEC-Q200 qualified thermal solution addresses unique challenges in electric vehicle power systems, combining robust construction with exceptional thermal performance.The Top Mount Skived design provides precise flatness ( 0.05mm/m ) required for automotive power modules. The manufacturing process eliminates internal stresses that could lead to micro-cracking in vibration environments.Specifically engineered for IGBT and TE0600 packages, the solution manages {Power Dissipation @ Temperature Rise} under hood temperatures reaching 125 C. The thermal interface maintains integrity across 1000+ thermal shock cycles (-40 C to +150 C).The Bolt On system meets automotive vibration requirements (ISO 16750-3) while allowing for serviceability. The titanium hardware resists galvanic corrosion in wet environments.High-conductivity Copper ( 390 W/m K) with nickel-plated finish resists automotive fluids. The material selection meets GMW3097 chemical resistance requirements.
Product Attributes
- Product Status: Active
- Type: Top Mount Kit
- Package Cooled: Raspberry Pi 4B
- Attachment Method: Adhesive
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: -
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