114070141

Seeed Technology Co., Ltd

General info

Part Number

114070141

Manufacturer

Seeed Technology Co., Ltd

Description:

HEATSINK WITH FAN FOR ODYSSEY -

Reference Price (USD)

$9.90000

500+

$9.801

1000+

$9.702

1500+

$9.603

2000+

$9.504

2500+

$9.405

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

114070141

$9.90

Product details

The 114070141 from Seeed Technology Co., Ltd represents cutting-edge thermal management in the Thermal - Heat Sinks category. Engineered for high-performance computing applications, this solution delivers exceptional heat dissipation while maintaining compact form factors. With advanced materials engineering and precision manufacturing, it sets new benchmarks for thermal efficiency in demanding environments.The Top Mount design ensures optimal contact pressure distribution, critical for BGA and LGA package cooling. When compared to traditional skived designs, this extrusion-type heatsink reduces thermal interface resistance by up to 15%.Optimized for high-power ASICs and BGA packages, this solution addresses thermal challenges in 5G base stations and AI accelerator cards. The multi-surface contact architecture supports power dissipation up to {Power Dissipation @ Temperature Rise}.Featuring Push Pin and Thermal Tape options, the mounting system accommodates various PCB thicknesses (0.8-2.4mm). For mission-critical applications, the bolt-on version provides vibration resistance exceeding MIL-STD-810G standards.The Square Fins configuration maximizes surface area-to-volume ratio, achieving {Thermal Resistance @ Forced Air Flow} at minimal airflow. Computational fluid dynamics analysis confirms 20% better laminar flow characteristics than rectangular alternatives.