114991695

The 114991695 from Seeed Technology Co., Ltd represents a cutting-edge solution in Embedded - System On Chip (SoC), engineered for high-performance embedded systems requiring precise signal processing. This SoC integrates advanced clock generation capabilities with robust thermal management, making it ideal for 5G infrastructure applications where signal integrity and low-latency operation are critical.Featuring an MPU architecture, this component delivers exceptional processing efficiency while maintaining deterministic timing characteristics essential for real-time systems.With its RISC-V Dual Core 64bit core, the device achieves optimal balance between computational throughput and power efficiency, enabling complex algorithm execution in power-constrained environments.The substantial 8MB/16MB/128MB flash memory accommodates extensive firmware libraries and real-time operating systems, providing developers with ample space for feature-rich applications.8MB of high-speed RAM ensures smooth multitasking performance, particularly beneficial for applications requiring rapid context switching and data buffering.Integrated peripherals including DMA, I²S, PWM, WDT offer designers unparalleled flexibility in system configuration, reducing BOM costs while enhancing I/O capabilities.Comprehensive I²C, SPI, UART/USART interfaces support seamless integration into heterogeneous networks, addressing the growing demand for interconnected industrial IoT solutions.Operating at 400MHz, the processor maintains exceptional timing precision critical for phase-sensitive applications like motor control and RF modulation.The Audio Processor (APU), Neural Network Processor (KPU) configuration provides hardware-accelerated processing paths that significantly outperform software-based implementations in jitter-sensitive operations.Rated for -30°C ~ 85°C, this component maintains stable clock synchronization even in thermally challenging environments such as automotive engine compartments.The compact Module footprint enables high-density PCB layouts without compromising thermal dissipation or EMI performance.Available in Module, the device supports automated pick-and-place assembly processes while ensuring reliable solder joint integrity.