114992082
Seeed Technology Co., Ltd
Product details
The 114992082 from Seeed Technology Co., Ltd delivers precision thermal management for medical devices in the Thermal - Heat Sinks category. Designed for reliability in life-critical applications, this solution combines biocompatible materials with exceptional thermal performance for imaging and diagnostic equipment.The Board Level Extrusion design provides EMI shielding compatibility crucial for sensitive medical electronics. The integrated grounding features reduce RF interference by 25dB compared to standard designs.Specialized for CPU and ASIC cooling in medical imaging systems, the solution handles {Power Dissipation @ Temperature Rise} with minimal acoustic signature. The thermal interface maintains stability through repeated sterilization cycles.Medical-grade Thermal Tape allows non-conductive attachment meeting IEC 60601-1 leakage current requirements. The adhesive maintains bond strength after 100+ autoclave cycles at 134 C.Rectangular Fins configuration achieves {Thermal Resistance @ Forced Air Flow} in laminar airflow environments. The streamlined design prevents particulate accumulation per ISO 14644 Class 5 cleanroom standards.
Product Attributes
- Product Status: Active
- Type: Board Level
- Package Cooled: Raspberry Pi 3, 4, B+
- Attachment Method: Bolt On and Thermal Tape, Adhesive (Included)
- Shape: Rectangular
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -