114992661
Seeed Technology Co., Ltd
114992661
Seeed Technology Co., Ltd
ARMOR LITE HEAT SINK WITH PWM FA
Reference Price (USD)
1+
$10.00000
500+
$9.9
1000+
$9.8
1500+
$9.7
2000+
$9.6
2500+
$9.5
Exquisite packaging
Discount
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114992661
$10.00
Product details
Seeed Technology Co., Ltd's 114992661 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.Optimized for LGA 4677 sockets, the solution manages {Power Dissipation @ Temperature Rise} at server inlet temperatures up to 45 C. The thermal interface maintains performance through 50,000 insertion cycles.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: Raspberry Pi 4B
- Attachment Method: Bolt On and Thermal Tape, Adhesive (Included)
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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