117249-2

TE Connectivity AMP Connectors's 117249-2 represents the gold standard in Card Edge Connectors - Contacts for next-generation 5G infrastructure. This innovative solution addresses the growing demand for high-speed, low-latency interconnects in RF signal chains. Its robust design meets stringent MIL-STD-202H vibration specifications.The Pin architecture is precision-engineered for impedance-matched connections up to 12GHz. Unlike conventional designs, it features anti-walk technology that prevents contact separation under mechanical stress.Utilizing Solder Post technology, this connector achieves IPC Class 3 reliability standards. The gas-tight interface prevents oxygen diffusion that could lead to contact oxidation over time.The Copper Alloy formulation has been optimized for low insertion force (LIF) applications without compromising contact normal force. Material properties ensure stable electrical characteristics across the -40 C to +105 C operating range.With Gold surface treatment, the contacts exhibit ultra-low mating friction while maintaining excellent EMI shielding properties. The proprietary plating process reduces insertion force by 30% versus standard finishes.The precisely controlled 50.0µin (1.27µm) guarantees consistent RF performance across all contacts. This is particularly critical for maintaining signal integrity in high-frequency array applications.