121720_REV1
Wakefield-Vette
121720_REV1
Wakefield-Vette
FLAT HEAT PIPE 8.1X3X100MM
Reference Price (USD)
1+
$14.76000
500+
$14.6124
1000+
$14.4648
1500+
$14.3172
2000+
$14.1696
2500+
$14.022
Exquisite packaging
Discount
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121720_REV1
$14.76
Product details
The 121720_REV1 from Wakefield-Vette represents cutting-edge thermal management technology in the Thermal - Heat Pipes, Vapor Chambers segment. Engineered for mission-critical applications, this solution delivers unparalleled heat dissipation efficiency through advanced phase-change mechanisms. With configurable form factors and military-grade materials, it ensures optimal thermal conductivity across demanding operating environments.Designed as a Heat Pipe, this component utilizes phase-change thermodynamics to achieve superior heat transfer rates compared to conventional solid conductors. Its dual-mode compatibility supports both vapor chamber and heat pipe configurations.Featuring multiple Epoxy or Solder options, the system accommodates diverse mounting requirements from high-vibration industrial setups to precision aerospace assemblies. The solder-attached variant demonstrates 40% higher shear strength than industry standards.The Flat geometry is optimized for maximizing surface contact area while minimizing airflow obstruction. Computational fluid dynamics simulations validate its 15% better thermal uniformity than competing profiles.Rated for 45.0W @ 100mm thermal loads, the solution handles transient heat spikes common in power electronics. The 150W capacity version supports overclocked CPU cooling at 95 C ambient.Incorporating Sintered capillary structures, the wicking mechanism achieves 0.25mm effective pore size for exceptional anti-gravity performance. Sintered copper variants exhibit 30% greater liquid return capacity.Available in 3.937" (100.00mm) dimensions, the scalable architecture supports thermal bridging across PCB layouts from compact IoT modules to server-grade component arrays. The 500mm version maintains <0.5 C/mm temperature gradient.Precision-engineered 0.319" (8.10mm) tolerances ensure seamless integration with high-density electronic packaging. The 11.20mm variant is specifically tuned for GPU VRM cooling applications.With z-axis profiles as slim as 0.118" (3.00mm), the low-profile design enables deployment in space-constrained embedded systems without compromising thermal performance.Constructed from Copper alloys, the housing combines corrosion resistance with exceptional thermal diffusivity. Copper versions achieve 401 W/m K conductivity ratings.
Product Attributes
- Product Status: Active
- Type: Heat Pipe
- Attachment Method: Epoxy or Solder
- Shape: Flat
- Power - Cooling: 45.0W @ 100mm
- Thermal Resistance: -
- Wick Type: Sintered
- Length: 3.937" (100.00mm)
- Width: 0.319" (8.10mm)
- Height: 0.118" (3.00mm)
- Diameter: -
- Operating Temperature: -
- Features: -
- Material: Copper
- Platform: -
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