122547
Wakefield-Vette
122547
Wakefield-Vette
HEATSINK EXTRUSION 15.25"
Reference Price (USD)
1+
$54.09000
500+
$53.5491
1000+
$53.0082
1500+
$52.4673
2000+
$51.9264
2500+
$51.3855
Exquisite packaging
Discount
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122547
$54.09
Product details
The 122547 from Wakefield-Vette represents cutting-edge thermal management in the Thermal - Heat Sinks category. Engineered for high-performance computing applications, this solution delivers exceptional heat dissipation while maintaining compact form factors. With advanced materials engineering and precision manufacturing, it sets new benchmarks for thermal efficiency in demanding environments.The Top Mount design ensures optimal contact pressure distribution, critical for BGA and LGA package cooling. When compared to traditional skived designs, this extrusion-type heatsink reduces thermal interface resistance by up to 15%.Optimized for high-power ASICs and BGA packages, this solution addresses thermal challenges in 5G base stations and AI accelerator cards. The multi-surface contact architecture supports power dissipation up to {Power Dissipation @ Temperature Rise}.The Square Fins configuration maximizes surface area-to-volume ratio, achieving {Thermal Resistance @ Forced Air Flow} at minimal airflow. Computational fluid dynamics analysis confirms 20% better laminar flow characteristics than rectangular alternatives.With a compact 15.250" (387.35mm) profile, this heatsink fits space-constrained designs common in edge computing devices. The optimized aspect ratio prevents airflow stagnation in dense server configurations.The 3.976" (101.00mm) dimension complements standard PCB layouts while providing sufficient mass for heat absorption. Thermal imaging shows uniform temperature distribution across the entire surface area.Precision-engineered 1.880" (47.75mm) creates optimal boundary layer separation, enhancing convective heat transfer. This parameter is particularly crucial for natural convection cooling scenarios.The Aluminum Alloy construction provides an ideal balance between thermal conductivity (180 W/m K) and weight considerations. For extreme environments, copper variants are available with optional nickel plating.
Product Attributes
- Product Status: Active
- Type: Top Mount, Extrusion
- Package Cooled: Power Modules
- Attachment Method: -
- Shape: Rectangular, Fins
- Length: 15.250" (387.35mm)
- Width: 3.976" (101.00mm)
- Diameter: -
- Fin Height: 1.880" (47.75mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: -
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