124673
Wakefield-Vette
124673
Wakefield-Vette
ROUND HEATPIPE 12X200MM 130W
Reference Price (USD)
1+
$11.71000
500+
$11.5929
1000+
$11.4758
1500+
$11.3587
2000+
$11.2416
2500+
$11.1245
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
124673
$11.71
Product details
Wakefield-Vette's 124673 redefines thermal management benchmarks in the Thermal - Heat Pipes, Vapor Chambers category. Optimized for next-generation computing architectures, this thermal solution combines innovative wick structures with military-spec construction for reliable operation in harsh conditions.Functioning as a Heat Pipe, the device employs two-phase heat transfer principles to achieve 5x better thermal conductivity than copper blocks. The vapor chamber variant features micro-channel reinforcement for 400W+ applications.Supporting Epoxy or Solder installation techniques, the system accommodates both permanent and serviceable thermal interfaces. Epoxy-mounted versions demonstrate 1000+ thermal cycles reliability.The Round configuration is aerodynamically optimized for forced convection systems. Rectangular profiles show 18% lower pressure drop in wind tunnel tests.Capable of handling 130.0W @ 200mm thermal loads, the solution manages heat flux densities up to 300W/cm . The 110W model is ideal for FPGA cooling.Utilizing Sintered fluid transport technology, the capillary action maintains continuous phase-change cycles. Grooved designs achieve 0.15mm effective pore size for high-G applications.Available in 7.874" (200.00mm) variants, the modular design enables custom thermal path optimization. The 450mm version is specifically engineered for rack-mounted server cooling.The 0.472" (12.00mm) OD circular models provide isotropic heat spreading for cylindrical packages. The 10mm OD version is optimized for laser diode cooling.Fabricated from Copper substrates, the construction balances weight and performance. Aluminum versions achieve 230 W/m K conductivity at 40% weight reduction.
Product Attributes
- Product Status: Active
- Type: Heat Pipe
- Attachment Method: Epoxy or Solder
- Shape: Round
- Power - Cooling: 130.0W @ 200mm
- Thermal Resistance: -
- Wick Type: Sintered
- Length: 7.874" (200.00mm)
- Width: -
- Height: -
- Diameter: 0.472" (12.00mm) OD
- Operating Temperature: -
- Features: -
- Material: Copper
- Platform: -
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