125645

Wakefield-Vette

General info

Part Number

125645

Manufacturer

Wakefield-Vette

Description:

7WX36" EXTRUSION 15837

Reference Price (USD)

$179.82000

500+

$178.0218

1000+

$176.2236

1500+

$174.4254

2000+

$172.6272

2500+

$170.829

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

125645

$179.82

Product details

The 125645 from Wakefield-Vette represents cutting-edge thermal management in the Thermal - Heat Sinks category. Engineered for high-performance computing applications, this solution delivers exceptional heat dissipation while maintaining compact form factors. With advanced materials engineering and precision manufacturing, it sets new benchmarks for thermal efficiency in demanding environments.The Top Mount design ensures optimal contact pressure distribution, critical for BGA and LGA package cooling. When compared to traditional skived designs, this extrusion-type heatsink reduces thermal interface resistance by up to 15%.Featuring Push Pin and Thermal Tape options, the mounting system accommodates various PCB thicknesses (0.8-2.4mm). For mission-critical applications, the bolt-on version provides vibration resistance exceeding MIL-STD-810G standards.The Square Fins configuration maximizes surface area-to-volume ratio, achieving {Thermal Resistance @ Forced Air Flow} at minimal airflow. Computational fluid dynamics analysis confirms 20% better laminar flow characteristics than rectangular alternatives.With a compact 36.000" (914.40mm) profile, this heatsink fits space-constrained designs common in edge computing devices. The optimized aspect ratio prevents airflow stagnation in dense server configurations.The 7.000" (177.80mm) dimension complements standard PCB layouts while providing sufficient mass for heat absorption. Thermal imaging shows uniform temperature distribution across the entire surface area.Precision-engineered 2.275" (57.78mm) creates optimal boundary layer separation, enhancing convective heat transfer. This parameter is particularly crucial for natural convection cooling scenarios.With 0.08°C/W in passive cooling scenarios, the design eliminates fan requirements in many applications. The fin spacing is optimized for natural convection currents.The Aluminum Alloy construction provides an ideal balance between thermal conductivity (180 W/m K) and weight considerations. For extreme environments, copper variants are available with optional nickel plating.