126773

Wakefield-Vette

General info

Part Number

126773

Manufacturer

Wakefield-Vette

Description:

FLATTENED, COPPER HEATPIPE, SINT

Reference Price (USD)

$13.16000

500+

$13.0284

1000+

$12.8968

1500+

$12.7652

2000+

$12.6336

2500+

$12.502

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

126773

$13.16

Product details

The 126773 from Wakefield-Vette represents cutting-edge thermal management technology in the Thermal - Heat Pipes, Vapor Chambers segment. Engineered for mission-critical applications, this solution delivers unparalleled heat dissipation efficiency through advanced phase-change mechanisms. With configurable form factors and military-grade materials, it ensures optimal thermal conductivity across demanding operating environments.Designed as a Heat Pipe, this component utilizes phase-change thermodynamics to achieve superior heat transfer rates compared to conventional solid conductors. Its dual-mode compatibility supports both vapor chamber and heat pipe configurations.Featuring multiple Epoxy or Solder options, the system accommodates diverse mounting requirements from high-vibration industrial setups to precision aerospace assemblies. The solder-attached variant demonstrates 40% higher shear strength than industry standards.The Flat geometry is optimized for maximizing surface contact area while minimizing airflow obstruction. Computational fluid dynamics simulations validate its 15% better thermal uniformity than competing profiles.Incorporating Sintered capillary structures, the wicking mechanism achieves 0.25mm effective pore size for exceptional anti-gravity performance. Sintered copper variants exhibit 30% greater liquid return capacity.Available in 5.906" (150.00mm) dimensions, the scalable architecture supports thermal bridging across PCB layouts from compact IoT modules to server-grade component arrays. The 500mm version maintains <0.5 C/mm temperature gradient.Precision-engineered 0.529" (13.43mm) tolerances ensure seamless integration with high-density electronic packaging. The 11.20mm variant is specifically tuned for GPU VRM cooling applications.With z-axis profiles as slim as 0.374" (9.50mm), the low-profile design enables deployment in space-constrained embedded systems without compromising thermal performance.Constructed from Copper alloys, the housing combines corrosion resistance with exceptional thermal diffusivity. Copper versions achieve 401 W/m K conductivity ratings.