1376260-2

The 1376260-2 from TE Connectivity AMP Connectors revolutionizes Backplane Connectors - Contacts for IoT edge devices. Developed for low-power wireless sensor networks, this compact connector enables reliable data transmission while consuming 40% less energy than conventional solutions during active states.Supporting Power protocols, the connector integrates EMI filtering directly into the contact array. This innovative approach reduces RF interference by 20dB without additional board space requirements.The Socket design features micro-power contact technology with activation currents as low as 10 A. This makes it ideal for energy harvesting applications where every microwatt counts.Utilizing Crimp methodology, the connection system achieves stable contact resistance below 50m at currents from 1mA to 1A. The broad dynamic range supports both sensor signals and power delivery.Compatible with 26-30 AWG ultra-fine wires, the termination system maintains pull-out strength above 8N while handling 30AWG conductors. The micro-crimp technology prevents strand breakage during installation.The Gold plating formulation minimizes triboelectric noise generation, critical for precision sensor applications. Tests show noise levels below 10nV/ Hz in the 0.1-10Hz bandwidth.With 30.0µin (0.76µm) coating control, the surface maintains optimal friction characteristics for 50,000 mating cycles. The proprietary lubrication system is baked into the plating process for permanent performance.