146733-1

The 146733-1 by TE Connectivity AMP Connectors establishes new performance benchmarks in Memory Connectors - PC Card Sockets, specifically designed for high-frequency RF applications. This innovative connector system delivers superior impedance matching and minimal insertion loss for millimeter-wave communication systems.Supporting PCMCIA standards, this solution enables seamless integration with phased array antenna systems. When compared to conventional RF connectors, it provides 30% better return loss characteristics up to 40GHz.With 68 carefully arranged contacts, the connector achieves optimal signal isolation for MIMO configurations. The ground-signal-ground layout minimizes cross-coupling between adjacent channels.Featuring Connector architecture, this connector maintains stable performance through 5,000 mating cycles. The patented dielectric design ensures consistent characteristic impedance across temperature variations.The Push In, Pull Out mechanism incorporates precision alignment guides for blind mating applications. Unlike standard designs, it provides audible confirmation of proper engagement without excessive insertion force.Engineered for Surface Mount installation, the connector supports both surface mount and through-hole configurations. Its thermal-compensation design prevents PCB warping during reflow processes.Incorporating Board Guide, this connector achieves 60dB isolation between ports at 28GHz. The integrated shielding technology exceeds IEEE 802.3ck standards for next-generation Ethernet applications.With ultra-low 0.551" (14.00mm) profile, the connector enables compact beamforming module designs. The optimized geometry minimizes signal path discontinuities in high-speed digital-RF systems.The Normal, Standard - Top option provides mechanical reinforcement for heavy coaxial cables. The strain relief system withstands 50N of pull force without compromising electrical performance.Utilizing Gold technology, the contacts maintain stable RF performance in humid environments. The specialized plating prevents oxidation while minimizing skin effect losses.Precision-controlled 30.0µin (0.76µm) ensures consistent surface roughness below 0.2 m RMS. This critical parameter maintains signal integrity at millimeter-wave frequencies.