16-350000-10-HT
Aries Electronics
16-350000-10-HT
Aries Electronics
SOCKET ADAPTER SOIC TO 16DIP 0.3
Reference Price (USD)
1+
$18.19958
500+
$18.0175842
1000+
$17.8355884
1500+
$17.6535926
2000+
$17.4715968
2500+
$17.289601
Exquisite packaging
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Product details
The 16-350000-10-HT by Aries Electronics sets new standards in Sockets for ICs, Transistors - Adapters solutions, specifically developed for autonomous vehicle systems requiring fail-operational performance. Its automotive-grade design exceeds AEC-Q200 qualification requirements for safety-critical applications.Supporting SOIC automotive component packages, this adapter enables seamless integration of ADAS sensors with vehicle domain controllers.The DIP, 0.3" (7.62mm) Row Spacing output configuration complies with automotive OEM requirements for vibration resistance and long-term reliability in under-hood environments.With 16 gold-plated contacts, the socket maintains signal integrity for high-speed automotive networks (CAN FD, Automotive Ethernet) while withstanding salt spray per ISO 9227.The 0.050" (1.27mm) spacing incorporates automotive-specific locking features that prevent connector back-out in high-vibration environments exceeding 15G RMS.Featuring Tin plating, the contacts achieve <5m contact resistance after 500 thermal cycles from -40 C to +125 C.The Through Hole installation method has been validated for automated assembly processes while providing mechanical stability meeting LV214 (Volkswagen) and USCAR-2 standards.Solder connections feature automotive-optimized crimp profiles that exceed 25N pull-out force requirements for safety-critical wiring harnesses.The 0.100" (2.54mm) post arrangement includes integrated moisture barriers that prevent capillary action of fluids in splash zone applications.Posts with Tin-Lead finish have been tested for 1000+ hours in 85 C/85% RH damp heat conditions without degradation.The Polyimide (PI) substrate maintains stable dielectric properties across automotive temperature ranges (-40 C to +150 C) with CTE matched to lead-free solder alloys.
Product Attributes
- Product Status: Active
- Convert From (Adapter End): SOIC
- Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Number of Pins: 16
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: Polyimide (PI)