1618-4-57-15-00-00-03-0
Mill-Max Manufacturing Corp.
Product details
The 1618-4-57-15-00-00-03-0 by Mill-Max Manufacturing Corp. redefines Contacts, Spring Loaded (Pogo Pins), and Pressure performance in high-speed computing applications, featuring {Mating Cycles} mating cycles with exceptional signal integrity. Engineered with {Contact Finish} plating at {Contact Finish Thickness}, these contacts deliver superior EMI shielding for server backplanes and data center equipment.Utilizing Contact Pad technology, these contacts maintain impedance control for high-speed differential pairs up to 56Gbps.The Surface Mount configuration enables high-density PCB layouts required in next-generation computing hardware.High-speed optimized Circular - 0.118" (2.99mm) Dia, 0.075" (1.91mm) H pad geometry minimizes parasitic capacitance in DDR5 memory interfaces.Advanced Brass Alloy alloy provides the ideal combination of conductivity and thermal management.
Product Attributes
- Product Status: Active
- Contact Type: Contact Pad
- Mounting Type: Surface Mount
- Maximum Working Height: -
- Recommended Working Height: -
- Minimum Working Height: -
- Pad Layout Dimension: Circular - 0.118" (2.99mm) Dia, 0.075" (1.91mm) H
- Operating Force - Initial: -
- Operating Force - Mid Compression: -
- Plunger Size: -
- Features: -
- Mating Cycles: -
- Contact Material: Brass Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)