172781-1

TE Connectivity AMP Connectors's 172781-1 represents a breakthrough in Terminals - Wire to Board Connectors technology, specifically developed for next-generation IoT devices and smart manufacturing equipment. This advanced wire-to-board solution combines unparalleled electrical performance with effortless installation, making it the preferred choice for Industry 4.0 applications.The Wire to Board architecture incorporates dual-locking mechanisms that prevent accidental disengagement in high-vibration scenarios, exceeding MIL-STD-202G specifications.Precision-machined 0.047" ~ 0.063" (1.19mm ~ 1.60mm) openings facilitate rapid PCB population while maintaining 0.02mm positional accuracy for automated pick-and-place operations.Engineered with 0.043" ~ 0.055" (1.10mm ~ 1.40mm) accommodation range, the strain relief system prevents conductor fatigue while supporting flexible and rigid cable types equally well.The 0.335" (8.50mm) dimensional profile has been optimized through computational fluid dynamics to enhance airflow in enclosed electronic assemblies.Supporting 26-30 AWG wire sizes, this terminal achieves 25% higher current density than conventional designs through innovative contact geometry.Brass construction delivers superior thermal conductivity, keeping temperature rise below 15 C at maximum rated current.The proprietary Tin plating process creates a nano-structured surface that maintains <5m contact resistance throughout the product lifecycle.