173-9-1212P

Wakefield-Vette

General info

Part Number

173-9-1212P

Manufacturer

Wakefield-Vette

Description:

THERM PAD 304.8MMX304.8MM GRAY

Datasheet:

173-9-1212P PDF

Reference Price (USD)

$35.14125

500+

$34.7898375

1000+

$34.438425

1500+

$34.0870125

2000+

$33.7356

2500+

$33.3841875

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

173-9-1212P

$35.14

Product details

Wakefield-Vette's 173-9-1212P delivers cutting-edge Thermal - Pads, Sheets solutions for next-generation 5G infrastructure. This high-performance thermal interface material addresses the unique thermal management challenges of RF power amplifiers and base station electronics.As a premium Sheet, this product combines exceptional thermal conductivity with excellent EMI shielding properties. This dual functionality simplifies thermal design in sensitive RF applications.Available in precision Square configurations, this material enables optimal thermal pathway design for complex RF modules. The geometrically optimized profiles ensure maximum heat transfer efficiency.Standard 304.80mm x 304.80mm sizes accommodate most common power amplifier packaging requirements. The size-optimized design allows for efficient thermal management in space-constrained base station equipment.With precise 0.0090" (0.229mm) control, this material provides predictable interface performance. The uniform cross-section ensures consistent thermal transfer characteristics across the entire contact area.The Polyimide reinforcement provides excellent dimensional stability during handling. This feature is particularly valuable for large-area applications requiring precise material placement.The Gray coding system facilitates quick material identification during assembly processes. This feature streamlines production workflows in high-mix manufacturing environments.With an exceptionally low 0.50°C/W value, this material minimizes thermal gradients across interfaces. The result is more stable operating temperatures for sensitive RF components.Delivering 1.2W/m-K performance, this solution enables more efficient thermal designs for high-power RF applications. The material's consistent performance helps maintain signal integrity in sensitive circuits.