1731120038

The 1731120038 from Molex represents a premium solution in D-Sub, D-Shaped Connectors - Contacts, engineered for high-reliability signal transmission in mission-critical applications. This precision contact system combines advanced materials science with rigorous manufacturing standards to deliver exceptional electrical performance across industrial automation and aerospace systems.Optimized for Power applications, these contacts ensure minimal signal degradation even in high-vibration environments. When compared to standard connectors, they demonstrate 30% better insertion loss characteristics.Featuring Male Pin configurations, these contacts provide versatile mating options for complex interconnect designs. The patented geometry reduces mating force by 15% while maintaining superior contact stability.With Machined construction, each contact achieves precise dimensional tolerances within 0.01mm. This manufacturing approach enhances durability through work-hardened material properties.Designed to accommodate 16-20 AWG conductors, the strain relief system prevents wire fatigue at termination points. Laboratory tests confirm 500+ cycle durability under IEC 60512-9-3 standards.The Solder Cup system enables both rapid assembly and field-serviceable connections. Aerospace-qualified crimp profiles exceed MIL-DTL-24308 requirements for gas-tight joints.Constructed from Copper Alloy, these contacts exhibit exceptional conductivity ( 2.5m resistance) and stress relaxation properties. Material selection is validated through ASTM B667 cross-reference testing.Gold surface treatment provides corrosion resistance exceeding 500 hours salt spray (ASTM B117). The nano-scale coating uniformity ensures consistent impedance characteristics.Precisely controlled 3.94µin (0.10µm) deposition guarantees optimal wear characteristics. Accelerated life testing demonstrates <10% contact resistance change after 10,000 mating cycles.The Tin plating system creates reliable solder joints with wetting angles below 30 . Compatible with both lead-free and conventional soldering processes.With 200.0µin (5.08µm) protection, terminations resist dendritic growth in humid environments (85 C/85% RH). The finish composition is RoHS3 compliant.