1747025-3

The 1747025-3 from TE Connectivity AMP Connectors is a high-performance Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) engineered for demanding board-to-board applications. This connector delivers exceptional signal integrity and power distribution capabilities, making it ideal for 5G base stations and high-speed computing systems. With its advanced contact technology and robust construction, it ensures reliable performance in harsh operating environments.Featuring a Plug, Outer Shroud Contacts configuration, this solution provides optimal mating stability while minimizing insertion loss. When compared to conventional designs, the patented contact geometry reduces crosstalk by up to 30%.Available in 80 contact arrangements, the connector supports flexible power delivery configurations. System designers can choose between signal-dominant or power-optimized layouts based on application requirements.The ultra-fine 0.020" (0.50mm) spacing enables high-density PCB layouts without compromising signal integrity. This precision spacing is particularly beneficial for miniaturized RF modules and compact embedded systems.With 2 rows configuration, the connector achieves balanced impedance characteristics across all channels. The symmetrical layout minimizes skew variation for high-speed differential pairs.Designed for Surface Mount, Right Angle installation, this connector simplifies assembly processes while maintaining mechanical robustness. The mounting system has been validated for automated pick-and-place operations.The inclusion of Solder Retention enhances both reliability and manufacturability. These engineered features address common challenges in vibration-prone applications while improving ESD protection.Utilizing Gold plating technology, the contacts maintain low contact resistance over 10,000 mating cycles. This finish selection provides optimal performance in humid environments.With 0.187" (4.75mm) profile, the connector maintains low aerodynamic interference in forced-air cooling systems. The optimized height contributes to better thermal management.