175-6-320P

Wakefield-Vette's 175-6-320P redefines excellence in Thermal - Pads, Sheets for mission-critical thermal management. Designed for aerospace and defense applications, this high-reliability solution combines cutting-edge materials science with precision manufacturing processes to deliver unmatched thermal performance.Specifically developed for TO-3 scenarios, this thermal interface excels in extreme environments. Its multi-directional heat transfer capability ensures consistent performance whether used in vertical or horizontal orientations, making it versatile for various assembly configurations.The Pad, Sheet construction provides exceptional dielectric strength while maintaining thermal efficiency. This dual functionality makes it particularly valuable in high-voltage applications where electrical isolation is as crucial as thermal management.Precision-engineered in Rhombus formats, this product enables optimal thermal pathway design. The geometrically optimized profiles minimize thermal impedance while maximizing contact area with heat-generating components.Available in 41.91mm x 28.96mm sizes, this solution accommodates both large-area cooling and localized hot spot management. The standardized dimensions ensure compatibility with common heat sink designs and mounting patterns.With a controlled 0.0060" (0.152mm) tolerance, this material provides predictable thermal performance. The uniform cross-section guarantees consistent interface pressure across the entire contact surface.The reinforced Polyimide structure enhances handling characteristics during automated assembly processes. This feature significantly reduces installation time while maintaining placement accuracy.The Gray pigmentation serves as a visual indicator of material grade and properties. This identification system streamlines inventory management and prevents misapplication in complex assemblies.With a remarkably low 0.40°C/W value, this material minimizes temperature gradients across interfaces. The result is more efficient heat transfer and reduced thermal stress on sensitive components.Achieving 0.5W/m-K performance, this solution enables more compact thermal designs. Engineers can specify smaller heat sinks without compromising cooling efficiency, saving valuable space in dense layouts.