18-350000-10-HT
Aries Electronics
18-350000-10-HT
Aries Electronics
SOCKET ADAPTER SOIC TO 18DIP 0.3
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Product details
Aries Electronics's 18-350000-10-HT sets new standards in the Sockets for ICs, Transistors - Adapters category, optimized for high-density electronic systems requiring precise package adaptation. Its advanced design addresses modern challenges in signal transmission and thermal management for next-generation applications.Supporting SOIC input configurations, this adapter excels in mixed-technology environments where multiple package types must coexist on the same PCB.The DIP, 0.3" (7.62mm) Row Spacing output options provide engineers with unparalleled flexibility when upgrading systems or integrating third-party components with different footprint requirements.With 18 precisely aligned contacts, the socket maintains uniform contact pressure across all terminals, essential for reliable power distribution in high-current applications.The 0.050" (1.27mm) mating pitch has been carefully selected to balance between space efficiency and ease of manual rework during development phases.Featuring Tin surface treatment, the contacts demonstrate superior wear resistance, particularly beneficial in test fixtures undergoing thousands of insertion cycles.The Through Hole installation method has been optimized for automated assembly processes while maintaining compatibility with manual soldering techniques.Solder termination ensures robust mechanical connections that withstand vibration and mechanical stress in automotive and aerospace applications.The 0.100" (2.54mm) post pitch accommodates high-density routing requirements while providing sufficient clearance for inspection and rework.Post contacts with Tin-Lead finish offer excellent oxidation resistance, maintaining reliable connections throughout the product lifecycle.Utilizing Polyimide (PI) as the base material ensures stable electrical characteristics across temperature variations encountered in outdoor applications.
Product Attributes
- Product Status: Active
- Convert From (Adapter End): SOIC
- Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Number of Pins: 18
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: Polyimide (PI)
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