18-35W000-10-P
Aries Electronics
18-35W000-10-P
Aries Electronics
SOCKET ADAPT SOIC-W TO 18DIP 0.3
Reference Price (USD)
1+
$12.02910
500+
$11.908809
1000+
$11.788518
1500+
$11.668227
2000+
$11.547936
2500+
$11.427645
Exquisite packaging
Discount
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Product details
Aries Electronics's 18-35W000-10-P redefines excellence in the Sockets for ICs, Transistors - Adapters market segment, offering unparalleled package conversion capabilities for cutting-edge electronic designs. Its precision-engineered architecture supports the most demanding applications from prototype to production.Compatible with SOIC-W packages, this adapter solves complex interfacing challenges in systems integrating components from different technology generations.The DIP, 0.3" (7.62mm) Row Spacing output configuration provides future-proofing flexibility, allowing designs to adapt to evolving component packaging trends.Featuring 18 high-reliability contacts, the socket maintains signal integrity even in noisy electromagnetic environments.The 0.050" (1.27mm) contact spacing has been carefully calculated to minimize capacitive coupling between adjacent signal paths.The Through Hole implementation allows for optimal thermal management and mechanical stability in high-vibration environments.With Solder termination, the adapter provides robust connections that withstand mechanical stress in portable and handheld devices.The 0.100" (2.54mm) post arrangement facilitates efficient PCB routing while maintaining sufficient clearance for automated optical inspection.Posts with Tin-Lead finish demonstrate exceptional solder joint reliability in temperature-cycling applications.The FR4 Epoxy Glass base material provides stable high-frequency performance essential for 5G and millimeter-wave applications.
Product Attributes
- Product Status: Active
- Convert From (Adapter End): SOIC-W
- Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Number of Pins: 18
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: FR4 Epoxy Glass