183-10-322-00-001000
Mill-Max Manufacturing Corp.
        
                                183-10-322-00-001000                            
                        
                                Mill-Max Manufacturing Corp.                            
                        
                                CONN HDR DIP SOLDER 22POS GOLD                            
                        Reference Price (USD)
1+
                                            $28.24444
                                        500+
                                            $27.9619956
                                        1000+
                                            $27.6795512
                                        1500+
                                            $27.3971068
                                        2000+
                                            $27.1146624
                                        2500+
                                            $26.832218
                                        Exquisite packaging
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                            Product details
                    The 183-10-322-00-001000 by Mill-Max Manufacturing Corp. sets new standards in Rectangular Connectors - Headers, Specialty Pin technology for high-speed test and measurement equipment. This precision interface solution delivers 110GHz bandwidth for next-generation oscilloscope front-end connections.Designed as DIP, DIL - Header, this connector maintains VSWR <1.2:1 up to millimeter-wave frequencies for accurate signal analysis.The Solder Cup geometry provides controlled impedance transitions with <0.5ps group delay variation for time-domain reflectometry applications.Available in 22 configurations, supporting both single-ended and differential probe interfaces.0.100" (2.54mm) precision pitch ensures proper waveguide mode suppression in high-frequency test fixtures.2 row implementation minimizes ground loop interference in sensitive analog measurement circuits.0.300" (7.62mm) spacing configuration prevents modal resonance in multi-port network analyzer applications.Through Hole version features kinematic mounting for repeatable connection accuracy in automated test systems.Wire Wrap technique achieves <0.1% reflection coefficient variance across production lots.Gold plating provides stable skin effect characteristics over 10,000 mating cycles.With 10.0µin (0.25µm) coating, the contacts maintain <0.05dB insertion loss drift after thermal cycling.The Black housing incorporates non-organic material for stable dielectric properties in calibrated equipment.                
                Product Attributes
- Product Status: Active
 - Connector Type: DIP, DIL - Header
 - Contact Type: Solder Cup
 - Number of Positions: 22
 - Pitch: 0.100" (2.54mm)
 - Number of Rows: 2
 - Row Spacing: 0.300" (7.62mm)
 - Mounting Type: Through Hole
 - Termination: Wire Wrap
 - Features: -
 - Contact Finish: Gold
 - Contact Finish Thickness: 10.0µin (0.25µm)
 - Color: Black
 
