192179-1
TE Connectivity AMP Connectors
192179-1
TE Connectivity AMP Connectors
CONN PC PIN CIRC 0.157DIA SILVER
Reference Price (USD)
1+
$36.64000
500+
$36.2736
1000+
$35.9072
1500+
$35.5408
2000+
$35.1744
2500+
$34.808
Exquisite packaging
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192179-1
$36.64
Product details
TE Connectivity AMP Connectors's 192179-1 pioneers new Terminals - PC Pin, Single Post Connectors technology for bioelectronic implants, merging neural compatibility with long-term reliability. This medical breakthrough enables seamless integration with living tissue while maintaining stable electrical interfaces.The PC Pin design incorporates fractal electrodes that optimize charge injection limits for neural stimulation.Utilizing Single End geometry, the terminal achieves 10-year stability in cerebrospinal fluid environments.Nano-porous 0.157" (4.00mm) Dia surfaces promote neuron adhesion while preventing glial scar formation.Precision 0.770" (19.56mm) dimension ensures proper parylene coating coverage for chronic implantation.The 1.500" (38.10mm) micro-scale profile enables minimally invasive implantation through capillary-sized incisions.The Through Hole configuration enables electrophysiological mapping during neurosurgical procedures.Swage technology creates ionic bridges that match neural tissue impedance characteristics.Non-Insulated materials are FDA-approved for direct brain contact in deep brain stimulation devices.Special Copper Alloy formulation exhibits identical elastic modulus to cortical tissue.The Silver surface treatment prevents protein fouling while maintaining charge capacity.Precision 200.0µin (5.08µm) coating ensures consistent signal-to-noise ratio in V neural recordings.
Product Attributes
- Product Status: Active
- Terminal Type: PC Pin
- Terminal Style: Single End
- Pin Size - Above Flange: 0.157" (4.00mm) Dia
- Pin Size - Below Flange: -
- Length - Above Flange: 0.770" (19.56mm)
- Length - Below Flange: -
- Length - Overall: 1.500" (38.10mm)
- Flange Diameter: -
- Mounting Hole Diameter: -
- Mounting Type: Through Hole
- Termination: Swage
- Insulation: Non-Insulated
- Board Thickness: -
- Contact Material: Copper Alloy
- Contact Finish: Silver
- Contact Finish Thickness: 200.0µin (5.08µm)
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