1981837-1
TE Connectivity AMP Connectors
1981837-1
TE Connectivity AMP Connectors
CONN SOCKET LGA 1366POS GOLD
Reference Price (USD)
1+
$15.74000
500+
$15.5826
1000+
$15.4252
1500+
$15.2678
2000+
$15.1104
2500+
$14.953
Exquisite packaging
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1981837-1
$15.74
Product details
TE Connectivity AMP Connectors's 1981837-1 enables next-generation Sockets for ICs, Transistors solutions for quantum computing applications. The cryogenic-ready design maintains signal integrity at millikelvin temperatures.The LGA architecture provides ultra-low thermal conductivity. Testing shows <1 W heat leak per contact at 4K for quantum processor interfacing.With 1366 (32 x 41), the socket supports complex qubit control. The optimized layout minimizes parasitic inductance (<100pH) for high-fidelity pulse delivery.0.040" (1.02mm) spacing prevents crosstalk in sensitive measurements. Testing shows <-80dB isolation at 10GHz for quantum state readout.Featuring Gold finish, the socket maintains superconductive properties. Resistance measurements show <10^-8 contact resistance at 4.2K.The 15.0µin (0.38µm) coating ensures thermal matching. CTE measurements show <1ppm/K difference to silicon substrates.Constructed with Copper Alloy, the socket minimizes magnetic susceptibility. SQUID measurements show <10^-8 emu/g at 4K.The Surface Mount design facilitates dilution refrigerator integration. Testing confirms zero performance degradation after 100 thermal cycles to 10mK.Incorporating Open Frame, the socket provides microwave shielding. Testing shows >60dB attenuation up to 40GHz for qubit protection.Solder technology ensures minimal thermal noise. Johnson noise measurements show <0.1nV/ Hz contribution at 4K.The 0.040" (1.01mm) spacing accommodates superconducting wiring. Critical current testing confirms >100mA per contact at 4.2K.The Copper Alloy posts maintain mechanical properties at cryogenic temperatures. Testing shows <0.1% elastic modulus change from 300K to 4K.Thermoplastic housing material provides radiopure construction. Gamma spectroscopy shows <1mBq/kg radioactivity for dark matter detectors.
Product Attributes
- Product Status: Obsolete
- Type: LGA
- Number of Positions or Pins (Grid): 1366 (32 x 41)
- Pitch - Mating: 0.040" (1.02mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15.0µin (0.38µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.040" (1.01mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: Copper Alloy
- Housing Material: Thermoplastic
- Operating Temperature: -
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