1SX280HU2F50E2VGS3
Intel
1SX280HU2F50E2VGS3
Intel
IC FPGA STRATIX 10 2397FBGA
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Product details
The 1SX280HU2F50E2VGS3 by Intel is a breakthrough in Embedded - System On Chip (SoC), designed for ultra-low-power IoT edge devices. This SoC combines energy-efficient processing with advanced sleep modes, making it perfect for battery-powered applications where power consumption and signal integrity are crucial for extended operational life.Utilizing a MCU, FPGA architecture, the device achieves unprecedented power efficiency while maintaining reliable data throughput for sensor fusion applications.The Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ core delivers optimal performance-per-watt ratios, enabling complex edge AI computations within tight energy budgets.With 256KB of ultra-low-leakage RAM, the processor maintains data retention during deep sleep modes critical for energy harvesting systems.Integrated DMA, WDT include precision ADCs and wireless interfaces that eliminate the need for external components in compact designs.The EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG options support both short-range and LPWAN protocols, ensuring seamless integration into diverse IoT ecosystems.Operating at 1.5GHz, the processor balances performance with power efficiency for always-on sensing applications.FPGA - 2800K Logic Elements feature hardware-accelerated encryption engines that secure device-to-cloud communications without compromising battery life.Rated for 0°C ~ 100°C (TJ), the component maintains reliable operation in extreme environmental monitoring applications.The 2397-BBGA, FCBGA package enables ultra-compact designs while providing robust thermal characteristics.Available in 2397-FBGA, FC (50x50), the device supports automated assembly processes for high-volume IoT product manufacturing.
Product Attributes
- Product Status: Discontinued at Digi-Key
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2800K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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