2-2013298-3
TE Connectivity AMP Connectors
Product details
TE Connectivity AMP Connectors's 2-2013298-3 represents the next evolution in Memory Connectors - Inline Module Sockets technology, optimized for industrial automation systems demanding ruggedized memory solutions. The 2-2013298-3 combines military-grade durability with cutting-edge signal integrity features.Utilizing SODIMM architecture, the connector achieves 360 shielding effectiveness for operation in electrically noisy factory environments with >60dB EMI suppression.The 204 configuration supports parallel memory bus architectures while maintaining crosstalk below -40dB at 5GHz frequencies for PLC applications.Specially engineered for DDR3 SDRAM compatibility, the contact system features dual-beam design that compensates for PCB warpage up to 0.15mm in harsh industrial conditions.Designed for Surface Mount, 25° Angle implementation, the package withstands 50G mechanical shock and 10G vibration profiles per IEC 60068-2 standards.The integrated Board Guide, Latches system enables tool-less module installation while providing IP67-rated dust/fluid protection for food processing machinery applications.Reverse configuration allows direct integration with backplane designs, reducing signal path length by 30% compared to conventional right-angle solutions.Gold surface treatment achieves >1000N/mm contact normal force, preventing micro-arcing in high-altitude industrial environments.With 30.0µin (0.76µm) deposition, the contacts maintain <2m resistance drift after 2000 thermal cycles from -40 C to +105 C.
Product Attributes
- Product Status: Obsolete
- Connector Style: SODIMM
- Number of Positions: 204
- Memory Type: DDR3 SDRAM
- Standards: -
- Mounting Type: Surface Mount, 25° Angle
- Features: Board Guide, Latches
- Mounting Feature: Reverse
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)