200-015-213L007
NorComp Inc.
200-015-213L007
NorComp Inc.
CONN D-SUB HD RCPT 15P R/A SLDR
Reference Price (USD)
1+
$2.27000
500+
$2.2473
1000+
$2.2246
1500+
$2.2019
2000+
$2.1792
2500+
$2.1565
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
200-015-213L007
$2.27
Product details
The 200-015-213L007 from NorComp Inc. sets the benchmark for high-reliability D-Sub Connectors in mission-critical applications. Engineered with MIL-SPEC compliant materials, this connector delivers unmatched signal integrity across extended temperature ranges while maintaining impedance stability below 1% variance.Designed for space-constrained applications, the D-Sub, High Density configuration ensures optimal PCB real estate utilization without compromising mating cycle durability (500+ cycles).Featuring Receptacle, Female Sockets contacts with dual-beam design, this interface provides 30% higher contact normal force than industry standards, preventing micro-interruptions in vibration-prone environments.The 15 contact arrangement supports hybrid power-signal distribution with isolated return paths, reducing crosstalk by 18dB compared to conventional layouts.With 3 precision-aligned rows, the contact pattern achieves 100% coplanarity compliance for zero-insertion-force mating requirements.The Panel Mount, Through Hole, Right Angle variant incorporates anti-rotation keying features that prevent misalignment during high-vibration operation (15G RMS random vibration tested).Optimized for EMI shielding effectiveness, the 1 (DE, E) High Density architecture provides 360 continuous shielding with <2 surface transfer impedance up to 6GHz.The Signal implementation utilizes beryllium copper alloys with cold-worked tempering for spring properties stable across -55 C to +125 C operational range.Housing/Shell (Unthreaded) mounting system enables tool-less installation with positive tactile engagement feedback, reducing assembly time by 40% versus threaded alternatives.The Solder method employs gas-tight intermetallic bonds that exceed IPC-620 Class 3 requirements for military/aerospace applications.Steel, Nickel Plated construction provides 96-hour salt spray resistance per ASTM B117 while maintaining <5m shell-to-shell conductivity.Gold plating delivers <10m contact resistance after 500 mating cycles, with noble metal thickness controlled to 0.05 m tolerance.Precision-controlled Flash deposition ensures fretting corrosion resistance exceeding 200 cycles per EIA-364-26 test protocol.The UL94 V-0 certified housing materials self-extinguish within 10 seconds after flame removal per UL94 vertical burn test.Derated for continuous operation, 3A capacity maintains <30 C temperature rise at 85% of maximum rated current.Board Lock include integrated Faraday cage shielding and drain wire provisions that achieve 60dB RFI attenuation from 10MHz to 1GHz.
Product Attributes
- Product Status: Active
- Connector Style: D-Sub, High Density
- Connector Type: Receptacle, Female Sockets
- Number of Positions: 15
- Number of Rows: 3
- Mounting Type: Panel Mount, Through Hole, Right Angle
- Shell Size, Connector Layout: 1 (DE, E) High Density
- Contact Type: Signal
- Flange Feature: Housing/Shell (Unthreaded)
- Termination: Solder
- Primary Material: -
- Shell Material, Finish: Steel, Nickel Plated
- Contact Finish: Gold
- Contact Finish Thickness: Flash
- Ingress Protection: -
- Material Flammability Rating: UL94 V-0
- Current Rating (Amps): 3A
- Backset Spacing: -
- Features: Board Lock
You May Also Be Interested In
