200-015-213L009
NorComp Inc.
200-015-213L009
NorComp Inc.
CONN D-SUB HD RCPT 15P R/A SLDR
Reference Price (USD)
1+
$0.00000
500+
$0
1000+
$0
1500+
$0
2000+
$0
2500+
$0
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
200-015-213L009
$0.00
Product details
Optimized for automotive Ethernet applications, NorComp Inc.'s 200-015-213L009 D-Sub Connectors delivers Category 5e performance in compact form factors. The innovative shielding design reduces EMI emissions by 18dB while supporting 1Gbps data rates.The D-Sub, High Density profile incorporates chamfered edges for tool-less mating in space-constrained vehicle harness assemblies.Receptacle, Female Sockets contacts feature dual-fork geometry that maintains <50m resistance after 25,000 vibration cycles per USCAR-2.The 15 layout separates power and signal contacts with integrated transient voltage suppressors rated for 40A surge.Precision-molded 3 dielectric bodies maintain impedance within 5 of nominal 100 differential pairs.Panel Mount, Through Hole, Right Angle configuration includes integrated PCB stiffeners that reduce flex-induced solder joint stress by 70%.The 1 (DE, E) High Density design features 12-point grounding contacts that maintain <10nH inductance up to 6GHz.Signal implementation uses nanocrystalline alloys that exhibit <3% resistance change from -40 C to +125 C.The Housing/Shell (Unthreaded) system incorporates conductive elastomer gaskets that maintain shielding integrity during 2mm panel misalignment.Our Solder methodology creates intermetallic bonds that survive 1000 thermal cycles from -55 C to +125 C.Steel, Nickel Plated provides >1000-hour corrosion resistance in GM9540P cyclic corrosion testing.The Gold surface treatment demonstrates <5% wear after 25,000 mating cycles per EIA-364-09.Precision-controlled 30.0µin (0.76µm) ensures proper noble metal diffusion barrier formation during extended thermal aging.All materials exceed UL94 V-0 requirements without red phosphorus additives for cleaner combustion.The 3A design incorporates current-sharing parallel paths that reduce thermal hot spots by 40%.Board Lock include integrated magnetics for 100Base-T1 applications with <1.5dB insertion loss at 100MHz.
Product Attributes
- Product Status: Active
- Connector Style: D-Sub, High Density
- Connector Type: Receptacle, Female Sockets
- Number of Positions: 15
- Number of Rows: 3
- Mounting Type: Panel Mount, Through Hole, Right Angle
- Shell Size, Connector Layout: 1 (DE, E) High Density
- Contact Type: Signal
- Flange Feature: Housing/Shell (Unthreaded)
- Termination: Solder
- Primary Material: -
- Shell Material, Finish: Steel, Nickel Plated
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Ingress Protection: -
- Material Flammability Rating: UL94 V-0
- Current Rating (Amps): 3A
- Backset Spacing: -
- Features: Board Lock
You May Also Be Interested In
